Diamond Copper Composite Hybrid Material ,semiconductor Devices Thermal Management

Diasemi  DICU Diamond Copper Composite 

Application:

High power density semiconductor device

Intensive computing AI chips

RF power amplifier

High power lase…

Properties:

                                        DICU1000    DICU800    DICU600 

Diamond Content            45 ±5%          35 ±5%     25 ±5%   

Thermal Conductivity      1000               800           600 W/m.K

CTE                                 5.8                  6.4           7.2 10^-6 /K

                                                      Adjustable to match Si, GaAs, GaN etc. wafer

Density                             5.5                5              4.5 g/cm3

Thickness                         0.35-5 mm

Size                                  2-50 mm

Coating Au, Ni

Customization of shapes, features properties welcomed

Complimentary engineering service with 24X7 hour response