Copper and diamond composite is the next game changer
十月24, 2025
Copper and diamond composite-- changing games and flexible solutions
With the rapid development of the electronics and information industry, electronic and semiconductor devices are evolving toward miniaturization, lightweight design, and high performance. The significant increase in power density leads to higher heat flux during device operation. Without timely heat dissipation, accumulated heat will severely affect the stability and reliability of the devices. Therefore, developing thermal management materials with excellent thermal properties has become a key issue in the electronics industry.
Existing packaging materials—such as W–Cu, Mo–Cu, SiCₚ–Al, SiCₚ–Cu, and BeO–Cu composites—can no longer meet the heat dissipation requirements of next-generation high-power devices and show limitations in high-output applications. To pursue higher thermal conductivity, diamond/copper composites have emerged as a promising new material.
Diamond, known for its exceptional hardness, also possesses an ultra-high thermal conductivity (1200–2200 W/m·K) and an extremely low coefficient of thermal expansion (CTE, about 1 ppm/K). However, its CTE mismatch with semiconductor materials restricts direct use. By combining diamond with metals such as copper—which has a compatible CTE, high thermal conductivity, and good processability—diamond-reinforced metal-matrix composites can achieve both high thermal performance and mechanical stability.
Among potential metal matrices, silver has the highest conductivity but is costly and dense; aluminum reacts with diamond to form unstable Al₄C₃. Copper, by contrast, offers a balance of high conductivity, moderate cost, and compatible CTE, making it the best choice. Consequently, diamond/copper composites are considered next-generation high-performance thermal management materials.
Commercial diamond/copper composites typically achieve thermal conductivities of 550–1000 W/(m·K), 1.5–2.5 times that of pure copper. By adjusting the diamond content (35–70 vol%), their CTE can be tuned between 5 × 10⁻⁶/K and 10 × 10⁻⁶/K, closely matching semiconductors such as Si (4.2 × 10⁻⁶/K) and GaAs (5.8 × 10⁻⁶/K). This reduces thermal stress and enhances device reliability.
In addition, diamond/copper composites combine high hardness, low density (~5.4 g/cm³), and excellent wear resistance, offering clear advantages in fields such as aerospace, power electronics, and high-performance packaging.
Diasemi has been the primary supplier of high thermal conductivity diamond copper composite heatsinks to top tier semiconductor ,electronic ,medical etc industries worldwide by offering a large family of copper and diamond products and customization services starting even only 1 pcs.
Applications
RF chips (Radio Frequency Chips) – improving heat dissipation in high-frequency, high-power signal devices.
LiDAR (Laser Detection and Ranging) – ensuring thermal stability for precision optical systems.
Charging stations – enhancing thermal management in high-current power modules.
High-power lasers – providing efficient heat removal to maintain laser output stability.
Optical communication devices – stabilizing temperature-sensitive photonic components.
Radar T/R modules (Transmit/Receive Modules) – reducing thermal stress and improving reliability in phased-array radar systems.
Robotics – enabling compact, high-efficiency power and control modules through lightweight, high-conductivity materials.
