Nano Polycrystalline Diamond NPCD
Nano Polycrystalline Diamond --- SiC GaN semiconductor industry Diasemi
With the rapid advancement of advanced manufacturing and new materials technologies, micro-/Nano Polycrystalline Diamond has become indispensable in precision polishing, ultra-precision machining, functional coatings, and high-end slurry formulations due to its extreme hardness, high specific surface area, and tunable surface chemistry. The accelerated expansion of third-generation semiconductors such as SiC and GaN is further driving the demand for high-purity, highly dispersible, and size-controlled micro-/materials.
Although detonation synthesis remains the most scalable and cost-effective route for producing micro-/Nano Polycrystalline Diamond, it faces persistent bottlenecks—including broad particle-size distributions, low graphite-to-diamond phase-transition efficiency, limited yield, and poor dispersion stability. These challenges represent both fundamental scientific issues and major engineering barriers to industrial adoption.
To address these limitations, Diasemi has developed a comprehensive technology framework for precision synthesis of detonation-derived micro-/nano-polycrystalline diamond:
Heterogeneous nucleation control, enabling narrow particle-size distribution;Hollow-framework catalytic systems, significantly enhancing phase-transition efficiency and enabling high-yield carbon conversion to diamond;
Next-generation detonation engineering platforms, overcoming conventional yield constraints and enabling a daily capacity over 100,000 carats.
In parallel, Diasemi established a dual stabilization strategy—“micro-scale screening + mesoscopic freezing”—and developed proprietary monodisperse, fully suspended micro-/nano-polycrystalline diamond polishing slurries capable of long-term high-solids stability. These products have been successfully deployed in a top tier 6-8 inch SiCwafer manufacturing fabs, delivering reliable solutions for achieving angstrom-level surface flatness in ultra-precision SiC wafer finishing.
Diasemi’s innovations provide a robust materials foundation for next-generation semiconductor manufacturing and the broader high-end precision-processing industry.
