Diasemi — Cooling the Future, One Layer at a Time

DIASEMI — Redefining Thermal Boundaries

Next-Generation Cooling, Powered by Diamond Additive ManufacturingHigh-resolution render of a copper microchannel cold plate with TPMS lattice and diamond-like internal glow effect.

Breakthrough in Thermal Design

Diasemi’s diamond-enabled 3D printing merges precision engineering and advanced materials science to deliver a new class of copper microchannel liquid-cooling plates.
In a single additive process, we create ultra-complex thermal structures that were once impossible to manufacture — integrating:

• TPMS lattice frameworks for optimized heat conduction

• Micro-fins and turbulence inducers for enhanced fluid mixing

• High-uniformity flow channels for reduced pressure loss

Performance That Pushes Limits

• Up to 3× higher heat transfer area vs. traditional microchannels

• >40% lower thermal resistance through diamond-assisted interfaces

• Compact, lightweight design ideal for power-dense systems

• Custom geometries tailored for chip-level or module-level cooling

 Applications

• AI and Data Center Processors

• Power Electronics & EV Modules

• Lidar & Laser Systems

• RF and Optoelectronic Devices

 Why Diasemi

• Proprietary diamond additive manufacturing platform

• Scalable metal–diamond hybrid integration

• Proven reliability under extreme heat flux (>1 kW/cm²)

Diasemi — Cooling the Future, One Layer at a Time.