Diamond Wafer Heat Sink Spreader
Diamond Wafer Heat Spreader Sink
www.diasemi.us
Diasemi ‘s diamond wafer heat spreaders (sinks) are the new generation of semiconductor material applied in the production of high performance electronic devices that require excellent thermal conductivity and heat dissipation.
Diamond material’s outstanding thermal conductivity, excellent electrical insulation, high mechanical strength, resistance of chemical corrosion makes diamond one of the most promising material for high power, high temperature, laser, etc critical application
Diasemi offers comprehensive DDTS (Diasemi Diamond Thermal Solutions )
Selective levels of performance and cost requirements (Wafer, Thermal, Optical, and Mechanical)
Custom sizes, shapes, thickness, surface roughness for specific applications
Flexible engineering support and fast responding customer service
Diasemi Diamond Wafer | Wafer level | Optical level | Thermal Level | Mechanical Level |
Growing Method | MPCVD | MPCVD | MPCVD | MPCVD |
Thickness | 0-500 um | 0-500 um | 0-500 um | 0-500 um |
Thickness tolerance | ±20 um | ±20 um | ±20 um | ±20 um |
Size | <60x60mm | <60x60mm | <60x60mm | <60x60mm |
Roughness of growth surface ra | <1nm | <30nm | <50nm | <100nm |
FWNM (D111) | 0.354 | 0.354 | 0.354 | 0.354 |
Coefficient of thermal expansion | 1.3(10·6K·1) | 1.3(10·6K·1) | 1.3(10·6K·1) | 1.3(10·6K·1) |
Thermal conductivity (T.C) | 1800·2000W/m.K | 1800·2000W/m.K | 1200·1800W/m.K | 1200·1600W/m.K |
TTV | ≤15μm | ≤15μm | ≤15μm | ≤15μm |
Warp | ≤40μm | ≤40μm | ≤40μm | ≤40μm |
Bow | ≤30μm | ≤30μm | ≤30μm | ≤30μm |