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Diamond Wafer Heat Sink Spreader

Diamond Wafer Heat Spreader Sink

www.diasemi.us

Diasemi ‘s diamond wafer heat spreaders (sinks) are the new generation of semiconductor material applied in the production of high performance electronic devices that require excellent thermal conductivity and heat dissipation.


Diamond material’s outstanding thermal conductivity, excellent electrical insulation, high mechanical strength, resistance of chemical corrosion makes diamond one of the most promising material for high power, high temperature, laser, etc critical application


Diasemi offers comprehensive DDTS (Diasemi Diamond Thermal Solutions )


Selective levels of performance and cost requirements (Wafer, Thermal, Optical, and Mechanical)

Custom sizes, shapes, thickness, surface roughness for specific applications

Flexible engineering support and fast responding customer service


Diasemi Diamond Wafer

Wafer level

Optical level

Thermal Level

Mechanical Level

Growing Method

MPCVD 

MPCVD 

MPCVD 

MPCVD 

Thickness

0-500 um

0-500 um

0-500 um

0-500 um

Thickness   tolerance

±20 um

±20 um

±20 um

±20 um

Size

<60x60mm

<60x60mm

<60x60mm

<60x60mm

Roughness of   growth surface ra

<1nm

<30nm

<50nm

<100nm

FWNM (D111)

0.354

0.354

0.354

0.354

Coefficient of   thermal expansion

1.3(10·6K·1)

1.3(10·6K·1)

1.3(10·6K·1)

1.3(10·6K·1)

Thermal   conductivity (T.C)

1800·2000W/m.K

1800·2000W/m.K

1200·1800W/m.K

1200·1600W/m.K

TTV

≤15μm

≤15μm

≤15μm

≤15μm

Warp

≤40μm

≤40μm

≤40μm

≤40μm

Bow

≤30μm

≤30μm

≤30μm

≤30μm