Diamond-Copper-Boron Composites Diamond/Cu (B) composites

Diamond-Copper-Boron Composites

Diamond/Cu (B) composites were fabricated via spark plasma sintering (SPS), incorporating diamond particles surface-treated using praseodymium oxide (Pr₆O₁₁) as an etching agent. The composites featured a diamond volume fraction of 60.0% and a boron volume fraction of 0.3%. The surface roughening of diamond particles enhanced interfacial contact area, while the introduction of boron into the copper matrix facilitated the in-situ formation of B₄C phases during sintering. These B₄C phases contributed to improved interfacial bonding between the diamond and copper phases.

The synergistic effect of increased diamond surface roughness and matrix alloying with boron significantly reduced interfacial thermal resistance. This optimization of interfacial structure promoted more efficient heat flux transfer across the composite, resulting in enhanced thermal conductivity.

As a result, the thermal conductivity of the diamond/Cu composites improved from 421 W·m⁻¹·K⁻¹ to 598 W·m⁻¹·K⁻¹, representing an approximate increase of 42%.