Diasemi Copper and diamond composite material

Diasemi copper and diamond composite material heat sink

Given the unique property of the highest thermal conductivity and extra low thermal expansion rate, copper and diamond (Cu-Dia) is poised to be one of the most promising material for next generation application in semiconductor,photonics, laser,mircowave, medical, aviation etc industry.

Diasemi.us is conducting researches in enhansing the thermal performance and cost effecive in copper and diamond material and providing products with thermal conductivity from 600--1000 W/m.k

Copper with highest purity 

Diamond with lowest nitrogen content

AI assisted calculation of diamond particle size ,agglomeration , percentage distribution

Thermal face infiltration and resistance

Diamond surface activity treament with Mo,Ti, W,Cr etc

Copper metal matrix  pretreament 

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Diasemi will be happy to customize  your requirement for different thermal conductivity, size and dimension, complicated machining,gold/silver plating etc.

Let us march forward together to develop next generation material for the future generations!