Diamond Heat Spreaders

DIAMOND HEAT SPREADERS AS SEMICONDUCTOR MEDIUM

DIASEMI can build heat spreaders for the most extreme possibilities.  As a material, diamond has no peer as a semiconductor medium.  The unsurpassed thermal conductivity of diamond and its high electrical resistivity allow for better performance across virtually all measures of semiconductor performance.  The ability of diamond to insulate high voltages across much thinner layers of material enables diamond to be used in lightweight applications.

Diamond offers three thermal conductivities tailored to the cost/performance requirement of our customers:

Low – black diamond 700-800 w/mK

Medium – opaque diamond 900-1000 w/mK

High – optically clear diamond 1700-1800 w/mK for the most difficult heat problems

We can make spreaders with lithographically patterned metallization and electrically isolate top and bottom surfaces.

Metallization solutions include:

Titanium, Platinum and Gold

Titanium, Nickel Gold

Chrome, Gold

Very flat and low roughness ensuring ease of attachment and minimized thermal interface resistances

Diamond is grown on 2” wafers that can be laser cut to any required size

Flat, smooth diamond with Metallization solutions enabling die bonding, standard soldering and brazing

Typical size

Small – 1.5 mm square

Large – 30 mm diameter

Max size for SC is 7 mm square

Standard thickness: 100 um, 300 um, 500 um, up to 1mm

Surface finish: <10nm Ra for poly

Material type: Single or poly mechanical grade (poly only), thermal grade or optical grade

Note: custom size and shapers are available