Petal-shaped pin-fin microchannel heat sink

HSAPP6---SPMC---HCP   As beautiful as flora cooling technology 

The continuous increase in power density in modern electronic devices has intensified thermal management challenges, particularly the formation of localized hotspots that degrade performance and reliability [1–6]. Conventional cooling approaches, including air cooling and traditional liquid cooling, are insufficient to address the combined requirements of high heat flux removal and temperature uniformity [7–9]. Microchannel heat sinks have therefore emerged as an effective solution due to their compact structure and high heat transfer efficiency.

The straight parallel microchannel (SPMC), originally proposed by Tuckerman and Pease, represents the most fundamental microchannel configuration, offering low pressure drop and simple fabrication. However, its performance is limited under non-uniform heat loads, where weak flow mixing leads to delayed thermal response and pronounced hotspot temperatures. Hybrid circular pin-fin (HCP) heat sinks enhance heat transfer by introducing pin-fin-induced flow disturbance, but this improvement is often accompanied by increased pressure drop and still limited hotspot suppression.

To overcome these limitations, this study proposes a novel Hybrid Staggered Arrangement of Petal-shaped Pin-fins embedded in Microchannels (HSAPP). Compared with SPMC and HCP designs, HSAPP employs petal-shaped pin-fins to generate strong, directed vortices in hotspot regions, while a staggered layout improves global flow redistribution. This integrated design aims to simultaneously suppress hotspot temperatures, enhance temperature uniformity, and maintain acceptable hydraulic performance under high-power electronic operating conditions.