Enhanced thermal conductivity and thermal shock resistance in diamond/copper composites through diamond surface etching

Diamond etching improves the thermal shock resistance of diamond/copper (D/Cu) composites. By treating diamond surfaces with tungsten coating and calcination, the diamond-copper interface is enhanced, resulting in better thermal conductivity and durability under thermal cycling. Compared to non-etched diamonds, the etched diamond-reinforced composites demonstrated superior performance, maintaining a high thermal conductivity of 597 W/mK even after 600 thermal shock cycles, with only a slight 6.4% reduction. This study highlights the significance of surface roughening in reducing thermal stress-induced damage, addressing a key limitation of D/Cu composites, and expanding their use in electronic packaging.