DIASEMI Diamond–Graphene Composite Film

A New Generation of Integrated Thermal Management and EMI Absorption Materials

As 5G communications, artificial intelligence, and high-power electronics continue to advance, increasing device integration and power density are creating unprecedented challenges in thermal management and electromagnetic interference (EMI) protection.

DIASEMI introduces an innovative Diamond–Graphene Composite Film, designed to integrate high-efficiency heat dissipation with electromagnetic wave absorption in a multifunctional material architecture.

The innovation combines high-thermal-conductivity diamond particles with electrically conductive graphene sheets in a flexible PDMS polymer matrix. Through carefully engineered material dispersion and interfacial integration, diamond particles bridge graphene layers to establish interconnected three-dimensional thermal pathways, improving heat transfer through the film thickness.

Meanwhile, graphene forms an in-plane conductive network that facilitates electromagnetic energy dissipation through dielectric and conductive losses, as well as multiple internal reflections. This architecture is designed to reduce unwanted electromagnetic reflection while maintaining efficient thermal transport.

Key Technological Features

• Enhanced Through-Plane Thermal Conductivity: Diamond particles create thermal bridges between graphene layers, addressing the inherent limitations of graphene in through-thickness heat transfer.

• Electromagnetic Wave Absorption: Graphene-based conductive networks promote electromagnetic energy attenuation and dissipation.

• Anisotropic Functional Architecture: Integrates in-plane electromagnetic attenuation with through-plane thermal transport.

• Flexible Composite Structure: PDMS-based matrix enables flexible film fabrication and potential integration into complex electronic assemblies.

• Multifunctional Performance: Combines thermal management and EMI protection within a single composite material platform.

Potential Applications

• 5G RF and microwave communication modules

• AI processors and high-performance computing systems

• High-power semiconductor packaging

• Advanced electronic devices and components

• Electromagnetic compatibility and thermal protection systems

DIASEMI — Engineering the Next Generation of Diamond-Based Functional Materials

By combining the exceptional thermal properties of diamond with the electrical and electromagnetic characteristics of graphene, DIASEMI aims to advance multifunctional carbon-based materials beyond conventional thermal management solutions.

One material platform. Two critical functions. A new approach to thermal and electromagnetic management.