Harder and tougher----three-dimensional interconnected multi-walled carbon nanotube (MWCNT) diamond composite

Harder and tougher----three-dimensional interconnected multi-walled carbon nanotube (MWCNT) diamond composite

Diamond/Cu Diamond Copper Heat Sink Reliability White Paper

Diamond/Cu Heat Sink Reliability White Paper diamond copper

DIASEMI Diamond Thermal Management Materials Qualification

DIASEMI Diamond Thermal Management Materials Qualification

LPPHT Laser Pulsed High Pressure High Temperature Technology Micro and Nano diamond

LPPHT Laser Pulsed High Pressure High Temperature Technology Micro and Nano diamond

DIASEMI Insulated Diamond–Copper Composite

DIASEMI Insulated Diamond–Copper Composite

Power the power electronics with CVD Diamond Heatsink

Power the power electronics with CVD Diamond Heatsink

DIASEMI Ultra-Thin AlN Insulated Diamond–Copper Heat Spreader

DIASEMI Ultra-Thin AlN Insulated Diamond–Copper Heat Spreader

Diamond Heatsinks: The Key Enabler of Huawei's Tao (τ) Law

Diamond Heatsinks: The Key Enabler of Huawei's Tao (τ) Law

Tear down the thermal wall. Unlock the full potential of your technology with DIASEMI Diamond

Tear down the thermal wall. Unlock the full potential of your technology with DIASEMI Diamond

DIASEMI CVD Diamond Microchannel Heat Sink

DIASEMI CVD Diamond Microchannel Heat Sink

MPCVD diamond general specifications

MPCVD diamond general specifications

Diamond/Aluminum Nitride Composite

Diamond/Aluminum Nitride Composite

DIASEMI advanced porous diamond low-k dielectric films

DIASEMI advanced porous diamond low-k dielectric films

Diamond knife blade for ultramicrotomy ,histology etc

diamond ultramicrotome knife

CVD Diamond Films on SiC for CMP Pad Conditioners

CVD Diamond Films on SiC for CMP Pad Conditioners

Diamond Thermal Manufacturing Platform (DTMP™): Beyond Precision Cutting

Diamond Thermal Manufacturing Platform (DTMP™): Beyond Precision Cutting

​SiC Diamond Al Composite

​SiC Diamond Al Composite

“Surface modification of hard diamond particles with Cu–Mo₂C double layer coating and its application in thermal conductive composites

Surface modification of hard diamond particles with Cu–Mo₂C double layer coating and its application in thermal conductive composites

Relieving the Residual Stresses in Diamond/Copper Combination Using Y₂W₃O₁₂ NTE Particles Doped Ag-Based Filler Alloys

Relieving the Residual Stresses in Diamond/Copper Combination Using Y₂W₃O₁₂ NTE Particles Doped Ag-Based Filler Alloys

Electroplating diamond and copper composite -a cost effective way to keep your technology cool

Electroplating diamond and copper composite -a cost effective way to keep your technology cool

Diamond copper；diamond aluminum; diamond silver composite

Silicon Nickel Titanium ,which base to choose for BDD(Boron doped diamond)

Silicon Nickel Titanium ,which base to choose for BDD(Boron doped diamond)

Simple adsorption-based immobilization of L-asparaginase on boron-doped diamond film

Simple adsorption-based immobilization of L-asparaginase on boron-doped diamond film

Three-dimensional additive fabric reinforced SiC–diamond composite

Three-dimensional additive fabric reinforced SiC–diamond composite

Diamond–Aluminum Composites for Advanced Semiconductor Thermal Management

Diamond–Aluminum Composites for Advanced Semiconductor Thermal Management