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Turnkey solutions for CVD Diamond and Silicon Wafer Heterogeneous Integration

Turnkey solutions for CVD Diamond and Silicon Wafer Heterogeneous Integration

Product Properties:

Turnkey solutions for CVD Diamond and Silicon Wafer Heterogeneous Integration

Applications

Turnkey solutions for CVD Diamond and Silicon Wafer Heterogeneous Integration

Ultra high thermal conductivity (1800-2200 W/m.K)

World class surface finish

Flatness, warpage ,TTV,surface roughness