Diasemi DiaCu Diamond and Copper Composite Heat Sink

Applications

Diasemi DiaCu Diamond and Copper Composite Heat Sink

Thermal conductivity  grade: (TC) at 300 K (W m-1 K-1) 

DiaCu 1000 

DiaCu 800

DiaCu 600 

Advantages :

Perfect hybrid of ultra high thermal conductivity and optimized cost

Improves thermal performance of the device package 

Increases device reliability 

Enhances output power 

Maintains performance and structural integrity after thermal cycle testing 

TC and CTE can be tuned by varying the copperdiamond composition 

Availability

Cu-Diamond can be supplied in sizes ranging from a few mm to several cm, and can be coated with thin metal layers, such as Au and Ni, allowing for compatibility with standard die attach bonding. Complex shapes and features, such as holes, steps and curves, can be produced according to customer requirements. Further details are available upon request