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Copper and diamond composite heat sink heat spreader

Copper and diamond composite heat sink heat spreader

Copper and diamond composite heat sink heat spreader

Product Properties:

SEMIXICON Diasemi Copper Diamond Composite Heat spreader/heatsink CTE :6-8 Thermal conductivity : 600-1000 W/(m.K)

Applications

Application :

Semiconductor

Laser

Microwave

Radar

Power transistor

Satellite