Applications
DIASEMI TDV Through Diamond Via
DIASEMI's proprietary TDV (Through-Diamond Via) technology addresses the industry's most challenging process barriers, including precision deep-via fabrication, interface modification, and defect-free electroplated copper filling. The platform consistently delivers aspect ratios up to 10:1 with complete, void-free metallization and exceptional process repeatability. Validated through high-volume production, the technology is fully qualified for scalable manufacturing and supports both standard production and customized solutions for RF power substrates, advanced semiconductor packaging, chiplet integration, and high-performance thermal management applications
