Applications
Diamond and copper composite heatsink with 5um gold (Au) Plating
www.diasemi.us
Ultra-high thermal conductivity up to 800-1000 W/Mk
Excellent corrosion and oxidation resistance
High electrical conductivity and stable contact resistance
Excellent solderability and wire-bonding compatibility
Improved surface reliability and durability
Good RF and high-frequency performance
Protects underlying metals such as Cu and Ni
Stable performance in demanding environments
Suitable for semiconductor, RF, optical, and electronic packaging application
