Applications
DIASEMI 12-Inch Diamond Membrane Wafer
DIASEMI’s 12-inch polycrystalline diamond membrane wafer represents a major step toward scalable diamond-based thermal management for next-generation semiconductors. Manufactured using microwave plasma chemical vapor deposition (MPCVD), the 300 mm freestanding diamond membrane achieves a thermal conductivity of approximately 1,700 W/m·K at a thickness of around 30 μm. Combining exceptional heat-spreading capability, electrical insulation, and wafer-scale dimensions, it offers promising potential for AI processors, advanced semiconductor packaging, high-power electronics, and next-generation chip cooling.
