Diasemi diamond and copper composite with conductive copper coating

Fremont , CA, Jan 31, 2025 – Diasemi has signed contract with a top tier semiconductor fab to supply  copper plated copper and diamond composite.

This product is a kind of novel formulated copper and diamond composite plated with additional copper film which delivers both high thermal and electrical conductivity, the product is introduced to be the most cost effective solutions to tackle the ever increasing thermal dissipation challenges in the rapid developing high power density semiconductor devices such as intensive computing AI chips, GaN RF power amplifier, High power laser etc.

Increasing thermal challenges, as the semiconductor industry moves into 3D packaging and continues to scale digital logic, are pushing the limits of R&D.

The basic physics of having too much heat trapped in too small a space is leading to tangible problems, like consumer products that are too hot to hold. Far worse, however, is the loss of power and reliability.

Diasemi’s diamond and copper composite has two models, one is DICU 800 which has about 800 W/mK thermal conductivity and DISU 600 which has a thermal conductivity around 600 W/mK, additional electric conductive enhancing coating optional.

The product can be manufactured with complex shapes, nano to micron level surface finishes and customers can bond this heat sinks with their devices easily.

Diasemi’s flexible and cost affordable diamond and metal composite solutions has provided with unlimited possibilities. Besides diamond and copper, Diasemi has also diamond and aluminum, diamond and silicon carbide etc products and some new combinations of diamond and other metal or ceramic materials being developed in the Silicon Valley lab.