Silicon Carbide bonded Diamond Composite Materials (Diasemi DSIC)

Diasemi Diamond and Silicon Carbide Composite Material (DSIC)

Silicon carbide (SiC)-bonded diamond materials, which contain about 50% diamond by volume, offer exceptional mechanical and thermal properties such as high hardness, wear and corrosion resistance, and excellent thermal conductivity. However, machining these materials is challenging due to their extreme hardness. Diamond grinding tools are commonly used, but they face issues like high grinding forces, elevated temperatures, and significant wear, which negatively impact surface quality and dimensional accuracy.

With more than 50 years of experience in the super hard material formulating ,grinding ,polishing lapping experience, SEMIXICON DIASEMI's innovation never stops and is always exploring new technology 's new application to process the new material.

To tackle these challenges, a laser-assisted grinding process has been developed. By using ultra-short pulsed lasers, material ablation is induced, which reduces grinding forces, lowers temperatures, and decreases tool wear. This process improves grinding efficiency and results in a significant reduction in forces—up to 70% less in tangential forces and 83% less in normal forces—while slightly improving surface roughness. The laser-assisted technique also results in a damage-free ground surface and a notable increase in grinding efficiency, with up to a 247% improvement in grinding ratio and a 99% increase in material removal rate compared to conventional methods. Additionally, the vitrified bonded diamond grinding wheel outperformed the segmented metal bonded wheels, producing lower grinding forces and higher material removal rates.