Cu–Diamond–Ag Composite
九月21, 2025
Cu–Diamond–Ag Composite:
Key Advantages
Electrical conductivity: Cu and Ag provide low, stable contact resistance; Ag improves electron mobility
.
Thermal conductivity: Cu (~400 W/m·K), Ag (~430 W/m·K), and diamond (>2000 W/m·K) → excellent heat dissipation and arc stability.
Mechanical strength: Diamond reinforcement enhances hardness and wear resistance; Cu provides toughness; Ag improves ductility.
Arc/welding resistance: Diamond resists arc erosion; Ag reduces welding tendency via conductive surface films.
Service life: Synergistic properties yield extended switching durability under high current loads.
Cost-performance: Lower Ag content than Ag-based contacts → reduced cost while maintaining high reliability.
Applications
Electrical Contact Materials
Relays, circuit breakers, contactors, switches
High-current, high-frequency switching components
Where arc erosion resistance and stable contact resistance are critical
Thermal Management Components
Heat spreaders and heat sinks for power electronics
High-power semiconductor packages (e.g., SiC, GaN devices)
Laser diode and microwave device cooling
High-Reliability Power Devices
Aerospace and defense electrical systems
Electric vehicle (EV) power modules
Renewable energy inverters and high-voltage DC transmission
Wear-Resistant Conductive Parts
Sliding contacts in generators and motors
Connectors exposed to high thermal and mechanical load
