Lenovo laptop to adopt diamond/copper (Diamond/Cu) composite heat-spreading technology

Diamond copper heatsink in bukl supply started !LENOVO Yoga  Slim 7i  Laptop  Diamond Copper Composite

Lenovo recently introduced the Yoga Slim 7i Aura Edition, the first consumer laptop to adopt diamond/copper (Diamond/Cu) composite heat-spreading technology at scale. This marks a pivotal shift in thermal management, where advanced materials—not just structural design—unlock higher computing performance.

Diamond/Cu combines diamond’s ultra-high thermal conductivity (~2200 W/m·K) with copper’s excellent electrical conductivity and manufacturability (~400 W/m·K). The result is a composite material capable of achieving 500–800+ W/m·K, significantly outperforming conventional Cu/W or pure copper heat spreaders.

A key advantage lies in its tunable coefficient of thermal expansion (CTE). By adjusting diamond content, Diamond/Cu can closely match semiconductor materials such as silicon, SiC, and GaN, minimizing thermal stress and improving device reliability.

The main technical challenge—poor wettability between diamond and copper—is solved through interface engineering. Thin coatings of carbide-forming metals (e.g., W, Ti) create strong chemical bonding and reduce interfacial thermal resistance.

With advances in infiltration processing, synthetic diamond cost, and interface control, Diamond/Cu is now entering mass commercialization, driven by AI chips, advanced packaging, and high-power electronics demanding next-generation heat dissipation solutions.