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Ultra - High Thermal Conductivity Diamond Wafer

Ultra - High Thermal Conductivity Diamond Wafer

Ultra - High Thermal Conductivity Diamond Wafer

Product Properties:

Ultra High Thermal Conductivity
High Mechanical Strength
Excellent Electrical Insulation
Low Dielectric Constant
Light Weight
Increased Power Density on Smaller Footprint






Applications

GENERAL TECHNICAL DATA

 

Preparation Method

MPCVD

Dimension

1-4 Inch Customizable

Thickness

0.3-1.0mm Customizable

Thickness Tolerance

±0.05mm

Surface Roughness

1-30nm

Thermal Conductivity

1200-2000 W/mK @300K Customizable

Coefficient of Thermal Expansion

1X10-6/K @300K

Specific Heat Capacity

0.502J/gK@300K

Density

3.52(x103Kg.m-3)

Vicker's Hardness

85-100 Gpa

Young's Module

1050 Gpa

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Product

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