Ultra - High Thermal Conductivity Diamond Wafer
Ultra High Thermal Conductivity
High Mechanical Strength
Excellent Electrical Insulation
Low Dielectric Constant
Light Weight
Increased Power Density on Smaller Footprint
GENERAL TECHNICAL DATA |
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Preparation Method | MPCVD |
Dimension | 1-4 Inch Customizable |
Thickness | 0.3-1.0mm Customizable |
Thickness Tolerance | ±0.05mm |
Surface Roughness | 1-30nm |
Thermal Conductivity | 1200-2000 W/mK @300K Customizable |
Coefficient of Thermal Expansion | 1X10-6/K @300K |
Specific Heat Capacity | |
Density | 3.52(x103Kg.m-3) |
Vicker's Hardness | 85-100 Gpa |
Young's Module | 1050 Gpa |
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