AgTiDia ---Diamond Silver Titanium Composite Material

Diamond/silver-titanium (Ag-Ti) composites created through pressureless sintering, focusing on improving the wettability between diamond and the silver matrix with a minor addition of titanium (Ti) will greatly increase the thermal conductivity. 

The  addition of Ti enhances interfacial bonding by forming a TiC phase at the diamond-silver interface. The thermal conductivity of the composite with 60 vol% diamond and 1.5 at% Ti reaches 953 W/m·K, achieving about 98% of the theoretical maximum, while maintaining compatible thermal expansion coefficients and excellent thermal cycling performance.

The background emphasizes the growing need for effective thermal management materials in electronics due to increased packaging density and heat generation. Traditional diamond metal-matrix composites face challenges like poor wettability and high production costs. This novel  low-cost fabrication method paved a new way addressing these issues, suggesting the composites are viable candidates for thermal management in integrated electronic devices.