Less is more, simple is the best, a new way peeling the veil of the diamond semiconductor industry

A new way of scalable production of ultra flat and ultra flexible diamond membrane film simply peel it off!

MPCVD Diamond film on KTN (KTa1-xNbxO3)

MPCVD Diamond film on KTN (KTa1-xNbxO3)

Growth of two-inch free-standing heteroepitaxial diamond on Ir/YSZ/Si (001) substrates via laser-patterned templates

Energy Enhanced polishing of diamond surface

Roughness control in the processing of 2-inch polycrystalline diamond films on 4H-SiC wafers

Superconductivity and Metallic Behavior in Heavily Doped Bulk Single Crystal Diamond and Novel Transportation Behavior at Graphene/Diamond Heterostructure

CVD Diamond Film In Biomedical Application

CVD Diamond Film In Biomedical Application

Boron-doped diamond (BDD) substrate

Boron-doped diamond (BDD) substrate

Atomic level surface control of diamond film

Atomic level surface control of diamond film

Quasi-2D Phonon Transport in Diamond Nano Thin Film

Quasi-2D Phonon Transport in Diamond Nanosheet

Diamond Metallization

Diamond Metallization

AgTiDia ---Diamond Silver Titanium Composite Material

AgTiDia ---Diamond Silver Titanium Composite Material

Ti-Based Phonon-Bridged Cu/Diamond Interfaces for Ultra-High Thermal Performance

GaSb membrane wafer integrated with CVD diamond heat spreaders

GaSb membrane wafer integrated with CVD diamond heat spreaders

SEMIXICON DIASEMI MPCVD Diamond Fiat lux------Let there be light

SEMIXICON DIASEMI MPCVD Diamond Fiat lux------Let there be light

CVD diamond microchannel cooling system for ultra-high heat flux chips

CVD diamond microchannel cooling system for ultra-high heat flux chips.

Diamond Titanium Composite 3D Printed for Smart Implants

Diamond Titanium Composite 3D Printed for Smart Implants

Copper and diamond composite is the next game changer

Copper and diamond composite

Scalable Electrostatic-Trapping of Single Nanodiamonds for Quantum Device Integration

Scalable Electrostatic-Trapping of Single Nanodiamonds for Quantum Device Integration

Diasemi — Cooling the Future, One Layer at a Time

Diasemi — Cooling the Future, One Layer at a Time.

Diasemi —Diamond (111) Homoepitaxy via Hot-Filament CVD: Growth Mode, Transition-Metal Incorporation, and Twin Formation

Diamond (111) Homoepitaxy via Hot-Filament CVD: Growth Mode, Transition-Metal Incorporation, and Twin Formation

Phonon Bridge Engineering for Enhanced Interfacial Thermal Transport in Si/Diamond Heterostructure

Phonon Bridge Engineering for Enhanced Interfacial Thermal Transport in Si/Diamond Heterostructure

Curved Graphite Precursors Enable Cubic–Hexagonal Diamond Heterostructures with Unprecedented Toughness–Hardness Synergy

Curved Graphite Precursors Enable Cubic–Hexagonal Diamond Heterostructures with Unprecedented Toughness–Hardness Synergy”

CVD Diamond Deposition Coating on Titanium Thermal Management

Depositing a diamond coating on a titanium substrate

Depositing a diamond coating on a titanium substrate